In your new role you will: Be the driver for technical definition (BOM, package design, Assembly technology, review PRP, project classification,
In your new role you will: Drive Package/leadframe 3D design development activities and ensure fulfillment of project milestone deliverables and documentation
In your new role you will: Drive Technology Integration activities to ensure the package fulfillall requirements in the aspect of Process Interaction.Execute
In your new role you will: Engineering assistance, accountable for on time DDM Responsible to execute fast disposition of the known and non-critical defects
In your new role you will: As system owner and technical expert in Electrical & Control system(HT,LT, FMCS) to support the business operation and business
In your new role you will: Test package generation for new IC or discrete products (software & hardware development).Test package performance optimization &
In your new role you will: Develop and execute a comprehensive automation strategy that aligns with the organization's overall manufacturing objectives and
In your new role you will: Responsible to lead and/or coach end-to-end data analytics & automationprojects covering MNC semiconductor backend sites.Key roles
In your new role you will: Conduct standard validations, time studies, method studies, data collection to determine IE standard and productivity improvement
In your new role you will: Responsible for I4.0 Back End Manufacturing, Data & Process Control Automation Scope includes Project manager for generic BE I4.0
In your new role you will: Conduct standard validations, time studies, method studies, data collection to determine IE standard and productivity improvement
In your new role you will: Perform process development activities (Process parameters scouting, optimization, verification and Process Freeze) in Development
In your new role you will: Define test concepts and test specifications for Integrated GaN solutions in cooperation with the concept engineering and design
In your new role you will: Define test concepts and test specifications for Integrated GaN solutions in cooperation with the concept engineering and design
In your new role you will: Yield improvement activities for Die Attach process Sustain and achieve stability index for package under responsibility Support
In your new role you will: To sustain, improve the process in order to deliver products to customers at committed functionality, reliability, time, volume and
In your new role you will: Checks the correctness of products through the validation of products after they have been produced (post-silicon) within a more
In your new role you will: Checks the correctness of products through the validation of products after they have been produced (post-silicon) within a more
In your new role you will: Act as the driver of Package Technology DFMEA.Act as the owner of Risk Interaction assessment and mitigation work
In your new role you will: Responsible to lead and manage escalation and facilitate discussion among all parties Responsible to setup effective indicators,